Published on: Wednesday, 18 March 2026 ● 2 Min Read
TAIPEI, March 18, 2026 -- In power electronics, MOSFET on-resistance RDS(on) typically increases as temperature rises, leading to higher heat generation, reduced efficiency, and potential thermal runaway. Para Light Electronics Co., Ltd. (6226.TW), a Taiwan-listed semiconductor packaging leader with over 35 years of expertise, today introduces a breakthrough solution: The ThermaFlat™ series of SiC MOSFETs.
Suppressing Thermal Runaway Risk
Leveraging decades of thermal engineering expertise, Para Light's ThermaFlat™ series delivers unprecedented RDS(on) stability across a wide operating temperature range from -25°C to +125°C. Most notably, the PC021S065ANC (650V) model maintains nearly constant resistance throughout this entire temperature span, paired with minimal switching loss. Even more remarkable is the high-voltage offering PD035S120ANC (1200V), which limits RDS(on) increase to a mere 26% over the same temperature range—a breakthrough performance that ensures superior system reliability, extended operational lifespan, and significantly lower thermal management costs. These advancements position the ThermaFlat™ series as a game-changer, defining the new global standard for SiC MOSFETs.

Technological Advancements for High Efficiency
Beyond thermal stability, the ThermaFlat™ series incorporates a Kelvin source pin in the TO-247-4 package. This design choice empowers ThermaFlat™ to achieve a maximum 35% reduction in switching losses, providing an outstanding Figure of Merit (FOM) and a tangible boost to overall system efficiency for demanding applications.
Strategic Applications
The ThermaFlat™ SiC MOSFETs are specifically engineered for critical infrastructure and industrial sectors, including:
Setting a New Standard for Power Efficiency
As global demand for high-efficiency power systems accelerates, Para Light's entry into the SiC MOSFETs market delivers a definitive solution to long-standing thermal challenges. By merging advanced packaging technology with innovative thermal design, the ThermaFlat™ series sets a new benchmark for reliability and efficiency in next-generation power electronics.
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